Electronic industrial use adhesive series
PROPERTIES CHART--- ELECTRONIC INDUSTRIAL USE ADHESIVE SERIES
Product |
Bonding substrates |
Color |
Viscosity |
Cure speed(min) |
Shear strength |
Temperature |
1120 | Suitable for porous bottom and printed PCB,damp proof and static resistance. |
lemon | 650~950 | 25°C/7min/72 | - | -45~+200 |
1331 |
Dampproof from PCB circuit- |
Clear |
200±20 |
10/24 |
- |
-65~+125 |
29230B |
General purpose, fast cured |
Black |
135,000 |
7/24 |
>3 |
-60~+120 |
29230C |
General purpose, fast cured |
Clear |
135,000 |
7/24 |
>3 |
-60~+120 |
29231 |
Fast cure speed, suitable for |
Black |
100,000 |
10/12 |
>3 |
-60~+120 |
29232B |
One component silicone, fast |
Black |
60,000 |
5/24 |
>1 |
-60~+250 |
29234 |
No odor, low shrinkage, |
Black |
50,000~ |
5/24 |
>1.5 |
-60~+232 |
29236 | PU fast cure adhesive, multi-purpose, shockproof |
Clear | 48,000~ 72,000 |
5/24 | >30 | -40~+66 |
29237B | new patent flexible polymeric sealing can be wildly used; Suitable for thin film and surface coating |
Black
|
560,000~
720,000 |
15~20/24
|
>22
|
-40~+80
|
29238 | Room temperature cure, low oder, suitable for glass,metal, concrete and materials |
Clear / white / black / gray light gray / deep amber/ aluminium gery |
Paste | 10/48 | >4 | -48 ~ +149 |
3332 | Low fluidness, suitable for automatic constant temperature control and power resistor radiator etc |
white | Paste | No cured | - | -55 ~ +180 |
8764 | Acrylic bonding, multi-purpose, shockproof, high strength |
gray | 100,000 | Valume ratio=1:1 10~12 / 24 |
>150 | -40 ~ +180 |
8765 | Acrylic bonding, multi-purpose, shockproof, high strength |
gray | 100,000 | Valume ratio=1:1 20~25 / 24 |
>150 | -40 ~ +180 |
8766 | Double tube black epoxy, IC wafer assembly protection |
Black | 40,000 | 30~90/24 | >210 | -55 ~ +120 |
8767 | A/B epoxy, suitable for electronic parts filling and coating |
Black | 4,500~5,500 | weight ratio=4:1 35 |
>132 | -40 ~ +120 |
8775 | Good flesible after cured, good durability, and can keep good shape when filling the electroic components, no flowing during heating process |
A: Milk White B: Light amber |
A: 16,000~26,000 B: <200 |
weight ratio=1:1 9/24 |
>150 | -40 ~ +120 |
9005-EC | Silver Conductive adhesive, hight viscosity, high conductivity, high thermal conductivity for LED chip |
sliver | 10,400~13,000 | +80°C for 30min +175°C for 60min |
>80 | -40 ~ +250 |
9008-EC | Silver Conductive adhesive, hight viscosity, high conductivity, high Diathermancy,suitable for LED |
sliver | 10,000~13,000 | +80°C for 30min ~ 60min |
>100 | -40 ~ +120 |