Electronic industrial use adhesive series - LETBOND TECHNOLOGY CO., LTD.

PROPERTIES CHART--- ELECTRONIC INDUSTRIAL USE ADHESIVE SERIES

Product No.	Bonding substrates and applications	Color	Viscosity (cp)	Cure speed(min) Full cure speed(hrs)	Shear strength (kgf/cm²)	Temperature Resistance(°C)
1120	Suitable for porous bottom and printed PCB,damp proof and static resistance.	lemon	650~950	25°C/7min/72	-	-45~+200
1331	Dampproof from PCB circuit- Board, anlistating, can be used In spray, dip in and brush ways	Clear Can be Test by Fluorescent Lamp	200±20	10/24	-	-65~+125
29230B	General purpose, fast cured Speed good bonding for metal Plastic, rubber, shock-proof	Black	135,000	7/24	＞3	-60~+120
29230C	General purpose, fast cured Speed good bonding for metal ,Plastic, rubber ,shock-proof	Clear	135,000	7/24	＞3	-60~+120
29231	Fast cure speed, suitable for Plastic and metal	Black	100,000	10/12	＞3	-60~+120
29232B	One component silicone, fast Cured in room temperature High voltage resistance	Black	60,000	5/24	＞1	-60~+250
29234	No odor, low shrinkage, Fast cured speed, High strength bonding	Black	50,000~ 100,000	5/24	＞1.5	-60~+232
29236	PU fast cure adhesive, multi-purpose, shockproof	Clear	48,000~ 72,000	5/24	>30	-40~+66
29237B	new patent flexible polymeric sealing can be wildly used; Suitable for thin film and surface coating	Black	560,000~ 720,000	15~20/24	>22	-40~+80
29238	Room temperature cure, low oder, suitable for glass,metal, concrete and materials	Clear / white / black / gray light gray / deep amber/ aluminium gery	Paste	10/48	>4	-48 ~ +149
3332	Low fluidness, suitable for automatic constant temperature control and power resistor radiator etc	white	Paste	No cured	-	-55 ~ +180
8764	Acrylic bonding, multi-purpose, shockproof, high strength	gray	100,000	Valume ratio=1:1 10~12 / 24	>150	-40 ~ +180
8765	Acrylic bonding, multi-purpose, shockproof, high strength	gray	100,000	Valume ratio=1:1 20~25 / 24	>150	-40 ~ +180
8766	Double tube black epoxy, IC wafer assembly protection	Black	40,000	30~90/24	>210	-55 ~ +120
8767	A/B epoxy, suitable for electronic parts filling and coating	Black	4,500~5,500	weight ratio=4:1 35	>132	-40 ~ +120
8775	Good flesible after cured, good durability, and can keep good shape when filling the electroic components, no flowing during heating process	A: Milk White B: Light amber	A: 16,000~26,000 B: <200	weight ratio=1:1 9/24	>150	-40 ~ +120
9005-EC	Silver Conductive adhesive, hight viscosity, high conductivity, high thermal conductivity for LED chip	sliver	10,400~13,000	+80°C for 30min +175°C for 60min	>80	-40 ~ +250
9008-EC	Silver Conductive adhesive, hight viscosity, high conductivity, high Diathermancy,suitable for LED	sliver	10,000~13,000	+80°C for 30min ~ 60min	>100	-40 ~ +120