Epoxy Resin Series - LETBOND TECHNOLOGY CO., LTD.

PROPERTIES CHART---EPOXY RESIN SERIES

Product No.	Bonding substrates and applications	Color	Viscosity (cp)	Curing condition((℃/min)	Hardness Shore D	Storage Method
3517	It is excellent in the repairable of electron chip use.	Black	1,280~1,920	120℃/10min	D84	Refrigerated at 2~8℃
3530	Suitable for E-book sealing	Black	2,400~3,600	80~120℃/10-120min	D72	Refrigerated at 2~8℃
3544W	Underfill gap filling, suitable LED sealing.	White	640~960	100~150℃/3-20min	D77	Refrigerated at 2~8℃
H3572L	Good for bonding Electronic components	Black	68,000~ 110,000	130℃/30min 150℃/10min	D89	Refrigerated at 2~8℃
H3575	For small gaps underfill Filling, flows fast, rework Is possible	Black	2,000~5,000	120℃/10min	D72	Refrigerated at 2~8℃
H3581	Good low temperature cure Characteristics, suitable For bonding electronic Components on PCB	Black	40,000~ 70,000	80℃/30min	D68	Freezer at -40℃
3582	Suitable for the bonding of lens module holder mount, has execllent adhesion strength whit LCP.	Black	180,000~ 240,000	80℃/5~10min	D86	Refrigerated at 2~8℃
3585	Suitable fixture for DIE.	White	Thixotropy 1,672,000~ 2,508,000	80℃/30min	D68	Freezer at -20℃
3595-07	Reworkable, low temperature cured, fast penetration	Black	700	100°C / 5 min 90°C/10 min	83±2	Refrigerated at 2~8℃
3595-09	Reworkable, low temperature cured, fast penetration	Black	900	100°C / 5 min 90°C / 10 min	83 ± 2	Refrigerated at 2~8℃
3602-4	Suitable for metal, glass and plastics, such as e-book sealing with hydrophobic character.	Yellow	Thixotropy 90,000~110,000	80°C / 60 min	D78	Freezer at -20℃
3602-5	Suitable for metal, glass and plastics, such as e-book sealing with hydrophobic character.	Yellow	Thixotropy 119,600~196,000	80°C / 60 min	D78	Freezer at -20℃
3613	Coating, sealant and adhesive.	Black	432,000~648,000	80 ~ 120°C / 240 min	D85	Refrigerated at 2~8℃
3618	Suitable for connector and flexible flat Cable adhesion.	Black	Thixotropy 40,000~100,000	80°C / 30 min	D68	Freezer at -40℃
3620	PCB coating.	White	Thixotropy 328,000~492,000	70 ~ 80°C/ 30 ~60 min	D85	Freezer at -20℃
3630	Suitable on electron product potting, gap filling and sealant.	Yellow	780~1,200	80°C / 30 min	D80	Freezer at -20℃
RES08-B	High temperature resistance High strength, for bonding Metal, ceramic, heat resistant Plastics, PCB etc.	Black	Thixotropy 36,000~42,000	150℃/40min	75±2	Refrigerated at 5~10℃